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Product Detailed Parameters
- Description：IGBT TRENCH FS 650V 200A DIE
- Series：-
- Mfr：onsemi
- Package：Bulk
- IGBT Type：Trench Field Stop
- Voltage - Collector Emitter Breakdown (Max)：650 V
- Current - Collector (Ic) (Max)：200 A
- Current - Collector Pulsed (Icm)：600 A
- Vce(on) (Max) @ Vge, Ic：1.9V @ 15V, 200A
- Power - Max：-
- Switching Energy：-
- Input Type：Standard
- Gate Charge：229 nC
- Td (on/off) @ 25°C：67ns/118ns
- Test Condition：400V, 200A, 15Ohm, 15V
- Reverse Recovery Time (trr)：-
- Operating Temperature：-40°C ~ 175°C (TJ)
- Mounting Type：Surface Mount
- Package / Case：Die
- Supplier Device Package：Die
- Grade：Automotive
- Qualification：AEC-Q101
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Overview
The PCGA200T65NF8M1 is a 650 V, 200 A Field Stop Trench IGBT module manufactured by onsemi. It utilizes water-cooled packaging for efficient thermal management in high-power applications. The device features a die size of 394 × 394 mils (10,000 × 10,000 μm) and an emitter attach area of 2 × (177 × 348). This component is designed for robust performance in industrial power conversion systems requiring high current handling capabilities.
Feature Summary
- Field Stop Trench technology for optimized switching performance
- Water-cooled package design for superior thermal dissipation
- High current density with 200 A rating
Applications
- Industrial motor drives
- High-power inverters
- Uninterruptible power supplies (UPS)
Procurement Notes
Verify the specific ordering suffix M1 against official onsemi documentation to ensure correct configuration. Confirm compatibility with existing cooling systems due to the water-cooled package type. Cross-reference datasheet revisions for any updates to electrical characteristics or mechanical dimensions before finalizing procurement specifications.
Selection Notes
Select this module for applications demanding high voltage blocking and substantial continuous current. Ensure the system design accommodates the specific water-cooling requirements associated with this package style. Evaluate thermal resistance parameters against the application's heat sink capabilities to maintain safe operating junction temperatures under full load conditions.
Part Context
This part belongs to onsemi’s portfolio of Field Stop Trench IGBT modules. These devices are engineered for efficiency in medium to high-power industrial applications. The PCGA series represents a specific packaging solution tailored for water-cooled environments, distinguishing it from air-cooled alternatives within the broader product line.
Replacement Considerations
Consult official onsemi substitution guides for verified equivalent parts. Direct replacements must match the 650 V rating, 200 A current capacity, and water-cooled package form factor. Verify pinout compatibility and thermal interface specifications before integrating substitute components into existing designs.
