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The PDTC123JK,115 is an NPN resistor-equipped transistor from the PDTC123J series manufactured by NXP Semiconductors. It integrates a base resistor (R1) of 2.2 kΩ and an emitter-base resistor (R2) of 47 kΩ within a single SOT346 (SC-59) surface-mount package. The device features a collector-emitter voltage rating of 50 V and a maximum DC output current of 100 mA. Key electrical characteristics include a minimum DC current gain (hFE) of 100 at IC = 10 mA, a collector-emitter saturation voltage of 100 mV max at IC = 5 mA, and a total power dissipation of 250 mW in free air at 25 °C ambient temperature.
Verify the ordering suffix '115' against official NXP documentation to confirm specific tape-and-reel packaging or manufacturing origin details. Ensure the SOT346 package marking code '49' matches the physical component received. Cross-reference the datasheet revision date (2004 Aug 13) with current product status on the manufacturer's website to confirm availability and any potential obsolescence notices before finalizing procurement plans.
Select this component when a compact NPN switching solution with integrated biasing is required. The SOT346 package offers a small footprint suitable for space-constrained designs. Verify that the 50 V collector-emitter voltage and 100 mA current ratings exceed the application's peak requirements. Consider the thermal resistance of 500 K/W for heat dissipation calculations if operating near the 250 mW power limit.
The PDTC123JK belongs to the broader PDTC123J series of NPN resistor-equipped transistors. This series includes various package options such as SOT23, SOT323, and SOT883, all sharing identical internal electrical characteristics but differing in physical dimensions and pin configurations. The JK variant specifically denotes the SOT346 (TO-236AB/SC-59A) plastic surface-mounted package with three leads.
Direct functional substitutes within the same series include PDTA123JK (PNP complement). Other packages like PDTC123JT (SOT23) or PDTC123JU (SOT323) offer identical electrical performance but require different PCB footprints. Verify pinout compatibility and thermal characteristics when substituting across different package types.