SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The PE128300A-Z is a dual-channel up/down converter from pSemi, designed for 5G mmWave active antenna systems. Operating within the 24.25 GHz to 29.50 GHz frequency range, it supports 5G bands n257, n258, and n261. The component utilizes UltraCMOS technology and is supplied as a flip-chip die in a reel package. It is engineered for integration with compatible beamforming ICs such as the PE188100 and PE188200.
Verify the specific manufacturing date code and lot traceability upon receipt. Confirm that the flip-chip die handling procedures align with your assembly capabilities. Ensure compatibility with the intended beamforming controller. Review the official datasheet for detailed thermal management requirements and soldering profiles to guarantee reliable operation in high-frequency environments.
Select this component when designing systems requiring integrated up/down conversion for 5G mmWave bands. It is suitable for applications needing direct interface with beamforming networks. Consider the flip-chip die format for compact PCB layout. Verify support for bands n257, n258, and n261 against network requirements. Evaluate integration with pSemi beamforming ICs for complete RF front-end solutions.
This device belongs to pSemi's UltraCMOS series of radio frequency components. It serves as a critical link between baseband processing and antenna elements in modern wireless infrastructure. The part addresses the need for efficient signal conversion at millimeter-wave frequencies. Its design focuses on minimizing insertion loss and power consumption in dense array configurations.
Publicly confirmed substitute part numbers are not available in the provided documentation. Consult pSemi technical support for potential alternatives or updated revisions.