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PE15A4067F is listed in the RF Amplifiers range at ChipApex. The manufacturer field lists Pasternack. Its product description is 27 dBm Psat, 26.5 GHz to 40 GHz,. Review the specifications below when checking this part for your BOM.
The PE15A4067F is a solid-state medium power RF amplifier manufactured by Pasternack, designed for operation within the 26.5 GHz to 40 GHz frequency range. This component delivers a minimum gain of 35 dB and features a saturated output power (Psat) rating of 27 dBm. It incorporates a low noise figure of 10 dB, making it suitable for high-frequency signal amplification tasks. The device utilizes a 2.92mm connector interface and includes an integrated heatsink to manage thermal performance during operation.
Verify the specific ordering suffix 'F' against official Pasternack documentation to confirm the inclusion of the heatsink and exact connector specifications. Ensure that the 2.92mm interface requirements align with system design constraints before procurement. Cross-reference the datasheet for precise thermal dissipation requirements associated with the integrated heatsink configuration.
Select this component when a medium power amplifier is required for frequencies between 26.5 GHz and 40 GHz. The 35 dB gain and 27 dBm Psat make it appropriate for applications needing significant signal boost without excessive power consumption. Consider the 10 dB noise figure for sensitivity-critical designs. The integrated heatsink simplifies thermal management compared to bare die solutions.
This part belongs to the Pasternack solid-state power amplifier series, specifically categorized as a medium power amplifier. It is distinct from lower-power gain blocks or higher-power final stage amplifiers within the manufacturer's portfolio. The model number indicates its specific frequency band and power class, differentiating it from other variants like the PE15A4055F which operates at lower frequencies.
Publicly confirmed substitute part numbers are not available in the provided source material. Verify compatibility with existing system interfaces and thermal requirements if considering alternative manufacturers.
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