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PEB4265TV1.2 is listed in the Telecom range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is DUSLIC DUAL CHANNEL SUBSCRIBER L. Review the specifications below when checking this part for your BOM.
The PEB4265TV1.2 is a Subscriber Line Interface Circuit (SLIC) manufactured by Infineon Technologies, designed for telecommunications applications. It integrates voice access functionality and supports IOM-2 and PCM interfaces. The device operates on a single 5 V supply voltage with a typical operating current of 70 mA. It is housed in a DSO-22 surface-mount package and supports two channels. The component functions within an industrial temperature range from -40 °C to +85 °C.
Verify the exact ordering suffix and revision level against official Infineon documentation to ensure compatibility with specific design requirements. Confirm RoHS compliance status through certified datasheets. Check current availability as this component may be subject to limited supply or discontinuation notices. Request original manufacturer test reports for quality assurance prior to integration into production lines.
Select this component when a dual-channel SLIC with integrated voice access is required for telecom infrastructure. Ensure the system design accommodates the 5 V power supply constraint and the DSO-22 footprint. Verify that the host processor supports the necessary IOM-2 or PCM signaling protocols. Consider thermal management requirements given the operating temperature range and power consumption characteristics.
This part belongs to Infineon's portfolio of telecom interface ICs, specifically within the SLIC category. It complements other voice access solutions by providing integrated line driving and protection features. The device is engineered for reliability in harsh industrial environments, supporting long-term deployment in critical communication networks.
Consult Infineon's official obsolescence notices for confirmed replacement part numbers. Cross-reference pinouts and electrical specifications with any proposed substitutes to ensure functional equivalence. Verify that alternative components meet the same interface and packaging requirements.
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