PEF 80912 H V1.4

Telecom Overview

The PEF80912H V1.4 is a second-generation modular ISDN interface integrated circuit manufactured by Infineon Technologies. Designed for telecom applications, this component facilitates digital communication within Integrated Services Digital Network (ISDN) systems. It supports surface-mount technology and is housed in a 44-pin Quad Flat Package (QFP). The device integrates necessary logic to manage ISDN protocols, enabling seamless connectivity for network equipment.

Telecom Feature Summary

• Supports second-generation modular ISDN interface protocols
• Designed for integration into legacy and current ISDN-based network equipment
• Utilizes surface-mount packaging for automated assembly

Telecom Applications

• ISDN network terminal equipment
• Digital telecommunication switching systems
• Legacy ISDN base station interfaces

Telecom Procurement Notes

Verify component authenticity through authorized Infineon distributors or certified supply chain partners. Confirm the specific V1.4 revision matches design requirements. Check for obsolescence status as indicated by supplier listings. Ensure storage conditions comply with moisture sensitivity levels for QFP packages prior to reflow soldering.

Telecom Selection Notes

Select this IC when designing hardware requiring native support for second-generation modular ISDN standards. Evaluate compatibility with existing system clocking and voltage domains. Consider the 44-QFP footprint constraints during PCB layout. Assess thermal dissipation capabilities relative to the enclosure's airflow characteristics.

Telecom Part Context

This component belongs to Infineon’s Q-SMINT series of telecom interface solutions. It serves as a specialized chip for managing digital subscriber line operations. The part represents an evolution in ISDN controller technology, offering enhanced reliability compared to earlier discrete implementations.