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PEF22553HTV2.1 is listed in the Telecom range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is LANTIQ PEF22553 TELECOMS IC. Review the specifications below when checking this part for your BOM.
The PEF22553HTV2.1 is a telecommunications IC from Infineon Technologies, part of the Lantiq family. It functions as a framer and Line Interface Unit (LIU) designed for digital subscriber line applications. The device supports E1, T1, J1, and HDLC interfaces, facilitating data transmission over copper lines. Operating within a temperature range of -40°C to 85°C, it utilizes a surface-mount package suitable for high-density PCB layouts. This component integrates essential signaling and framing capabilities required for robust telecom network connectivity.
Verify the exact suffix 'HTV2.1' against official Infineon documentation to confirm pinout and electrical characteristics. Confirm current product status, as availability may vary. Ensure compatibility with existing board designs regarding voltage levels and thermal requirements before integration.
Select this component when specific support for E1, T1, J1, or HDLC protocols is required in a compact form factor. Consider the operating temperature range and package type for environmental suitability. Evaluate integration complexity against alternative Lantiq series devices if broader feature sets are needed.
This IC belongs to the Lantiq telecommunications portfolio, focusing on broadband access solutions. It serves as a critical interface between the network infrastructure and subscriber lines, handling protocol conversion and signal framing. The device is engineered for reliability in carrier-grade environments.
Consult official Infineon substitution guides for direct replacements. Verify functional equivalence regarding supported interfaces and package dimensions. Cross-reference with newer generations in the Lantiq lineup for potential performance upgrades.
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