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— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Powerex PP300D120 is a POW-R-PAK™ Half Bridge IGBT Assembly rated at 300A and 1200V. It integrates F-series trench gate IGBTs with low conduction and switching losses, mounted on a forced air-cooled heatsink. The assembly includes a low inductance laminated bus structure, isolated gate drive power supplies, and a 3300 µF DC-link capacitor bank. It supports DC bus voltages up to 800VDC and switching frequencies above 20kHz. Absolute maximum ratings include an IGBT junction temperature of -40°C to +150°C, collector current of 300A (600A peak), and isolation voltage of 2500VAC.
Verify the specific ordering suffix if required, as it may indicate variations in connector type or feedback options. Confirm that the application environment adheres to the specified operating temperature range of -25°C to +85°C and utilizes forced air cooling at the recommended airflow rate. Ensure the DC bus voltage does not exceed the absolute maximum rating of 800VDC. Check for compatibility with the specified 14-pin or 16-pin header connectors based on the selected feedback configuration.
Select this assembly for high-efficiency half-bridge topologies requiring integrated protection and feedback. The unit is suitable for applications demanding switching frequencies above 20kHz and robust thermal management via forced air cooling. Consider the integrated 3300 µF DC-link capacitance when designing the input filter requirements. Evaluate the need for DC link voltage feedback to determine the appropriate connector pin count and mating hardware specifications.
This component belongs to the Powerex POW-R-PAK™ family of configurable IGBT-based power assemblies. These modules are engineered for high-power density and reliability in industrial power electronics. The series typically encompasses various configurations including converters, choppers, full bridges, and three-phase inverters, all utilizing advanced trench gate technology for optimized performance.
No public confirmed substitute part numbers are available in the provided documentation.