PS2562-1-A

Overview

The PS2562-1-A is a single-channel transistor output optocoupler manufactured by Renesas Electronics. It features an NPN phototransistor output housed in a 4-pin DIP package for through-hole mounting. The device provides an insulation voltage of 5000 Vrms and supports a maximum collector current of 200 mA with a collector-emitter voltage of 40 V. Key electrical parameters include a minimum current transfer ratio of 200%, a forward current rating of 80 mA, and a forward voltage of 1.17 V. The component operates within a temperature range of -55°C to +100°C and dissipates up to 150 mW.

Feature Summary

• Provides high-voltage isolation between input and output circuits via optical coupling.
• Utilizes an NPN phototransistor output stage for robust signal switching capabilities.
• Designed for reliable operation across extended industrial temperature ranges.

Applications

• Industrial control systems requiring galvanic isolation
• Power supply feedback loops for voltage regulation
• Solid-state relay driver circuits

Procurement Notes

Verify the specific suffix and manufacturer designation when sourcing, as component availability may vary by region. Confirm that the procurement channel sources directly from authorized distributors or the manufacturer to ensure authenticity. Check RoHS compliance status and lead times prior to finalizing orders, as supply chain conditions can impact delivery schedules for this specific part number.

Selection Notes

Select this component when a high current transfer ratio and substantial collector current capacity are required for isolated switching applications. The 80 mA forward current capability allows for efficient drive requirements compared to lower-current alternatives. Ensure the 40 V collector-emitter voltage rating aligns with the load specifications. Consider the DIP-4 package constraints for PCB layout and thermal management during the design phase.

Part Context

This device belongs to the PS2562 series of transistor output optocouplers from Renesas Electronics. It shares the same internal die and functional characteristics as the PS2562L-1-A but differs in packaging configuration. While the L-series variant utilizes surface-mount technology, the PS2562-1-A is specifically designed for through-hole insertion, offering mechanical stability for applications where solder joint durability is prioritized over board space efficiency.

Replacement Considerations

The PS2562L-1-A serves as a functional equivalent with identical electrical specifications but utilizes a surface-mount package. Direct pin-to-pin replacement is not possible due to the different mounting styles. Designers must evaluate PCB footprint changes and assembly process adjustments if substituting between the through-hole and surface-mount variants within the same product family.