PS8502L3-V-AX

Overview

The PS8502L3-V-AX is a high-speed optocoupler manufactured by Renesas Electronics. It features a single channel with a data rate of 1 Mb/s and an insulation voltage of 5000 Vrms. The device utilizes a photo IC output type, supporting a forward current of 16 mA and an output current of 8 mA. Key electrical parameters include a current transfer ratio of 15%, a forward voltage of 1.7 V, and a reverse voltage of 5 V. Power dissipation is rated at 100 mW. The component operates within a temperature range of -55°C to +100°C and is available in an 8-pin DIP package.

Feature Summary

• Provides high-speed signal transmission with a data rate of 1 Mb/s for efficient digital isolation.
• Ensures robust electrical safety through a high insulation voltage rating of 5000 Vrms between input and output circuits.
• Integrates a photo IC output structure to deliver stable performance across wide industrial temperature ranges.

Applications

• Industrial automation systems requiring reliable signal isolation
• Power supply circuits needing feedback loop isolation
• Communication interfaces demanding high common-mode rejection

Procurement Notes

Verify the specific suffix configuration against official Renesas documentation to ensure compatibility with required packaging and environmental standards. Confirm that the selected variant matches the intended thermal and electrical specifications for the target application environment before finalizing procurement orders.

Selection Notes

Select this component when designing circuits that require high-speed digital isolation with significant voltage barriers. Ensure the system design accommodates the specified forward current limits and power dissipation constraints while maintaining adequate thermal management for operation within the defined temperature range.

Part Context

This part belongs to the PS8502 series of high-speed optocouplers from Renesas Electronics. The series is designed for applications requiring fast switching speeds and strong galvanic isolation capabilities. The specific model indicates a standard DIP package configuration suitable for through-hole mounting in various electronic assemblies.

Replacement Considerations

Consult official cross-reference lists for verified substitutes. Ensure any replacement maintains identical pinout, insulation voltage, and data rate specifications to guarantee functional equivalence without redesigning the host circuit board.