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The PSS15S92F6-AG is a Dual-In-Line Package Intelligent Power Module (DIPIPM) manufactured by Mitsubishi Electric, originally developed under the Powerex brand. This component integrates six IGBT switches with built-in gate drivers into a single compact unit. It features a 600 V collector-emitter voltage rating and supports a continuous collector current of 15 A at 25 °C. The module utilizes a 25-PowerDIP package configuration for through-hole mounting. Key electrical specifications include a collector-emitter saturation voltage of 1.7 V and a power dissipation capacity of 27 W. It operates within a temperature range starting from -30 °C.
Verify the manufacturer designation carefully during procurement, as this component is associated with both Powerex Inc. and Mitsubishi Electric Semiconductor. Ensure the specific ordering suffix matches the required package variant. Confirm that the intended application environment falls within the specified operating temperature limits and thermal dissipation requirements to maintain reliability.
Select this module when a compact solution for three-phase motor control or low-power inversion is required. The integrated driver simplifies the gate drive circuit design compared to discrete components. Consider the 15 A current rating and 600 V blocking voltage against the load requirements. Evaluate the thermal management needs based on the 27 W power dissipation specification and the through-hole mounting constraints.
This component belongs to the Version 6 DIPIPM series, designed to simplify the development of low-power inverters. The series includes variants with different current ratings, such as the PSS20S92F6-AG and PSS30S92F6-AG, all sharing similar packaging and functional integration principles. The PSS15S92F6-AG represents the lower current option within this specific family line.
Direct substitutes within the same series include the PSS20S92F6-AG and PSS30S92F6-AG, which offer higher current ratings but share the same package and voltage characteristics. Verify pin compatibility and thermal performance before substituting with higher-rated models.