Q8006L5

Triacs Overview

The Littelfuse Q8006L5 is a bidirectional triac rated for 800 V repetitive peak off-state voltage and 6 A RMS on-state current. It features a gate trigger voltage of 2.5 V and a gate trigger current of 50 mA, with a maximum holding current of 50 mA. The device exhibits an on-state voltage of 1.6 V and a leakage current of 50 uA at rated voltage. Designed for through-hole mounting in a TO-220 package, it operates within a temperature range of -40 C to +125 C.

Triacs Feature Summary

• Provides electrical isolation via an isolated tab design certified by UL
• Utilizes a glass-passivated junction structure for enhanced reliability
• Functions as a solid-state switch for AC power control applications

Triacs Applications

• Motor speed control systems
• Temperature modulation circuits
• AC phase control implementations

Triacs Procurement Notes

Verify the specific datasheet version and compliance documentation directly with Littelfuse or authorized distributors before procurement. Confirm that the TO-220 package variant matches the required thermal and mechanical constraints for the target application. Ensure all regulatory standards are met for the intended market.

Triacs Selection Notes

Select this component when an 800 V blocking capability and 6 A continuous current rating are required for AC switching tasks. The TO-220 form factor supports efficient heat dissipation for moderate power levels. Consider the 50 mA gate drive requirement for compatible control circuitry design.

Triacs Part Context

This part belongs to the Low Power TRIAC series up to 1200V from Littelfuse. It represents a standard solution for general-purpose AC switching where reliable isolation and robust surge handling are necessary. The series is widely used in consumer and industrial electronics requiring precise phase control.

Triacs Replacement Considerations

Consult official Littelfuse substitution guides for verified equivalents. Cross-reference parameters such as voltage ratings, current capabilities, and package dimensions to ensure functional compatibility without modifying the existing board layout.