QFEM-S106-TR1G

Description：MODULE PA
Series：-
Mfr：Broadcom Limited
Package：Tape & Reel (TR)

SKU:90629d0e945a Category: RF Front End (LNA + PA) Brand: Broadcom Limited

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Product introduction

QFEM-S106-TR1G is listed in the RF Front End (LNA + PA) range at ChipApex. The manufacturer field lists Broadcom Limited. Its product description is MODULE PA. Review the specifications below when checking this part for your BOM.

RF Front End (LNA + PA) specifications for QFEM-S106-TR1G

Description：MODULE PA
Series：-
Mfr：Broadcom Limited
Package：Tape & Reel (TR)
RF Type：-
Frequency：-
Features：-
Package / Case：-
Supplier Device Package：-
Grade：-
Qualification：-

RF Front End (LNA + PA) datasheet and documents for QFEM-S106-TR1G

QFEM-S106-TR1G

RF Front End (LNA + PA) Overview

The QFEM-S106-TR1G is an RF front-end module manufactured by Broadcom Limited. It integrates a power amplifier designed for Wi-Fi applications, operating within a supply voltage range of 3 V to 4.2 V. The component supports surface-mount technology and functions at maximum operating temperatures up to +85 C. It dissipates up to 150 mW under high output power conditions. The device is RoHS compliant and lead-free.

RF Front End (LNA + PA) Feature Summary

Integrates a power amplifier for Wi-Fi signal transmission
Operates with supply voltages between 3 V and 4.2 V
Supports surface-mount installation in compact modules

RF Front End (LNA + PA) Applications

Wi-Fi connectivity modules
Internet of Things (IoT) devices
Wireless communication hardware

RF Front End (LNA + PA) Procurement Notes

Verify component authenticity through authorized distributors or official manufacturer channels. Confirm RoHS compliance status and lead-free specifications against current regulatory requirements. Ensure the supplier provides valid documentation matching the QFEM-S106-TR1G part number to avoid counterfeit risks. Check for any specific handling instructions related to moisture sensitivity if applicable.

RF Front End (LNA + PA) Selection Notes

Select this component for designs requiring integrated Wi-Fi power amplification. Consider the 150 mW dissipation limit when designing thermal management solutions for tightly packed IoT modules. Verify that the system operates within the specified 3 V to 4.2 V supply range. Ensure the application environment does not exceed the +85 C maximum operating temperature rating.

RF Front End (LNA + PA) Part Context

Broadcom Limited produces semiconductor solutions including wireless connection chips. The QFEM-S106-TR1G belongs to their portfolio of RF front-end components used in modern wireless infrastructure. This module supports the company's focus on integrating complex radio frequency functions into compact packages for consumer and industrial electronics.