QID1210007

$200.13

Description：IGBT MODULE 1200V 100A 730W
Series：-

SKU:09969d121301 Category: IGBT Modules Brand: Powerex Inc.

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Product introduction

Product Detailed Parameters

Description：IGBT MODULE 1200V 100A 730W
Series：-
Mfr：Powerex Inc.
Package：Bulk
IGBT Type：-
Configuration：2 Independent
Vce(on) (Max) @ Vge, Ic：6.5V @ 15V, 100A
Input：Standard
NTC Thermistor：No
Operating Temperature：-40°C ~ 150°C (TJ)
Mounting Type：-
Package / Case：-
Supplier Device Package：-
Voltage - Collector Emitter Breakdown (Max)：1200 V
Current - Collector (Ic) (Max)：100 A
Power - Max：730 W
Current - Collector Cutoff (Max)：1 mA
Input Capacitance (Cies) @ Vce：16 nF @ 10 V

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QID1210007

Overview

The Powerex QID1210007 is a split dual silicon/silicon carbide hybrid IGBT module rated for 1200 V collector-emitter voltage and 100 A continuous collector current. It integrates two individual switches, each paired with a reverse-connected super-fast recovery free-wheeling SiC Schottky diode. The device features an isolated copper baseplate with aluminum nitride insulation to facilitate thermal management. Designed for high-frequency hard switching up to 30 kHz and soft switching up to 80 kHz, it offers low off-state switching energy and low internal inductance of 10 nH.

Feature Summary

Split dual configuration containing two independent switches per module
Integrated discrete super-fast recovery free-wheeling silicon carbide Schottky diodes
Isolated copper baseplate utilizing aluminum nitride isolation for simplified heat sinking

Applications

High frequency power systems including UPS, induction heating, and robotics
Energy saving power systems such as fans, pumps, and consumer appliances
High temperature power electronics in electric vehicle and aviation systems

Procurement Notes

Verify the specific revision status against the manufacturer's latest documentation before finalizing design integration. Confirm that the preliminary information aligns with current production capabilities and testing data. Ensure all electrical ratings and thermal characteristics match the system requirements for the intended operating environment.

Selection Notes

Select this component for applications requiring high-frequency operation above standard silicon limits. The hybrid Si/SiC architecture supports efficient soft switching scenarios. Evaluate the thermal resistance values against the specific cooling solution to ensure junction temperatures remain within the specified maximum rating during peak load conditions.

Part Context

This module belongs to the Powerex IGBT product line designed for high-frequency power conversion. It utilizes a split dual topology to provide two isolated switching channels within a single package. The construction emphasizes low internal inductance and robust thermal isolation to support demanding industrial and automotive power electronics environments.