R8A774C0HA01BG#U0

Description：IC MPU RZ/G2E 1.2GHZ 552FBGA
Series：RZ/G2E
Mfr：Renesas Electronics Corporation
Package：Tray

SKU:729e63b6349f Category: Microprocessors Brand: Renesas Electronics Corporation

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Product introduction

R8A774C0HA01BG#U0 is listed in the Microprocessors range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC MPU RZ/G2E 1.2GHZ 552FBGA. Review the specifications below when checking this part for your BOM.

Microprocessors specifications for R8A774C0HA01BG#U0

Description：IC MPU RZ/G2E 1.2GHZ 552FBGA
Series：RZ/G2E
Mfr：Renesas Electronics Corporation
Package：Tray
Core Processor：ARM® Cortex®-A53
Number of Cores/Bus Width：2 Core, 64-Bit
Speed：1.2GHz
Co-Processors/DSP：Multimedia; NEON™ MPE
RAM Controllers：DDR3L
Graphics Acceleration：No
Display & Interface Controllers：MIPI-CSI
Ethernet：10/100Mbps (1), 100/1000Mbps (1)
SATA：-
USB：USB 2.0 (1), USB 3.0 (1)
Voltage - I/O：-
Operating Temperature：-40°C ~ 85°C (TA)
Security Features：-
Mounting Type：Surface Mount
Package / Case：552-FBGA
Supplier Device Package：552-FBGA (21x21)
Additional Interfaces：CAN, I2C, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
Grade：-
Qualification：-

Microprocessors datasheet and documents for R8A774C0HA01BG#U0

R8A774C0HA01BG#U0

Microprocessors Overview

The R8A774C0HA01BG#U0 is a microprocessor IC from the RZ/G2E series manufactured by Renesas Electronics Corporation. It features an ARM Cortex-A53 core processor with dual cores and a 64-bit architecture, operating at a maximum frequency of 1.2GHz. The device is housed in a 552-FBGA package measuring 21x21 mm. It supports DDR3L RAM controllers and includes interfaces such as MIPI-CSI, USB 2.0, USB 3.0, Ethernet (10/100Mbps and 100/1000Mbps), CAN, I2C, MMC/SD/SDIO, SPI, and SSI. The operational temperature range is -40°C to 85°C.

Microprocessors Feature Summary

Dual-core ARM Cortex-A53 processing capability for high-performance embedded applications
Integrated multimedia processing engine supporting NEON and MPE technologies
Comprehensive connectivity suite including Gigabit Ethernet, USB 3.0, and MIPI-CSI display interface

Microprocessors Applications

Industrial automation systems requiring robust real-time processing
Smart home appliances with advanced connectivity needs
Medical equipment utilizing embedded control architectures

Microprocessors Procurement Notes

Verify the specific suffix #U0 against official Renesas documentation to confirm packaging and handling requirements. Ensure compatibility with required DRAM types listed in the validated memory list. Confirm RoHS3 compliance status for your region's regulatory standards before finalizing procurement orders.

Microprocessors Selection Notes

Select this component when dual-core performance at 1.2GHz is sufficient for the application workload. Consider the 552-FBGA package constraints during PCB layout design. Evaluate the integrated peripheral set against system interface requirements to minimize external controller dependencies.

Microprocessors Part Context

This part belongs to the RZ/G2E family of ultra-high performance microprocessors designed for embedded devices. The series emphasizes energy efficiency and multimedia capabilities within a compact form factor, targeting cost-sensitive yet performance-demanding markets.