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The R8A774E0HA01BN#YJC is a specialized application processor within the Renesas RZ/G2H series. It integrates four 64-bit ARM Cortex-A53 cores and two ARM Cortex-A57 cores, operating at frequencies up to 1.2 GHz and 1.5 GHz respectively. The device utilizes a 1022-ball FCBGA package with dimensions of 29x29 mm. It supports LPDDR4 memory controllers and includes an integrated display unit (DU). The component operates within a temperature range of -40°C to 85°C and features interfaces including USB 2.0 OTG, USB 3.0, Ethernet, CANbus, I2C, SPI, and MMC/SD/SDIO.
Verify the specific suffix YJC against official Renesas documentation to confirm pinout compatibility and functional equivalence with standard variants like #G0. Ensure that design-in requirements match the specified package type and thermal characteristics. Confirm RoHS compliance status through current datasheets before finalizing procurement specifications.
Select this component when a balance between power efficiency and processing performance is required for complex embedded tasks. The inclusion of both A53 and A57 cores allows for flexible task distribution. Verify that the target application can utilize the available peripheral interfaces such as USB 3.0 and multiple Ethernet ports effectively.
This microprocessor belongs to the RZ/G2H family, designed for general-purpose embedded Linux and Android applications. It serves as a mid-range solution within the RZ/G2 lineup, offering more processing power than the RZ/G2E while consuming less power than higher-end models. The series targets cost-sensitive yet performance-demanding industrial and commercial markets.
R8A774E0HA01BN#G0