R8A774E0HA01BN#YJC

R8A774E0HA01BN#YJC

$151.17
  • Description:SOC RZ/G2H HDMI OFF (WS)
  • Series:RZ/G2E
  • Mfr:Renesas Electronics Corporation
  • Package:Tray

SKU:3bc35a19539f Category: Brand:

  
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Product Detailed Parameters

  • Description:SOC RZ/G2H HDMI OFF (WS)
  • Series:RZ/G2E
  • Mfr:Renesas Electronics Corporation
  • Package:Tray
  • Core Processor:ARM® Cortex®-A53, ARM® Cortex®-A57
  • Number of Cores/Bus Width:4, 4 Core, 64-Bit
  • Speed:1.2GHz, 1.5GHz
  • Co-Processors/DSP:-
  • RAM Controllers:LPDDR4
  • Graphics Acceleration:Yes
  • Display & Interface Controllers:DU
  • Ethernet:10/100Mbps (1)
  • SATA:-
  • USB:USB 2.0 OTG (2), USB 3.0 (1)
  • Voltage - I/O:3.3V
  • Operating Temperature:-40°C ~ 85°C
  • Security Features:-
  • Mounting Type:Surface Mount
  • Package / Case:1022-BFBGA, FCBGA
  • Supplier Device Package:1022-FCBGA (29x29)
  • Additional Interfaces:CANbus, DMA, I2C, I2S, MMC/SD/SDIO, PCI, SPI, UART
  • Grade:-
  • Qualification:-

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R8A774E0HA01BN#YJC

Overview

The R8A774E0HA01BN#YJC is a specialized application processor within the Renesas RZ/G2H series. It integrates four 64-bit ARM Cortex-A53 cores and two ARM Cortex-A57 cores, operating at frequencies up to 1.2 GHz and 1.5 GHz respectively. The device utilizes a 1022-ball FCBGA package with dimensions of 29x29 mm. It supports LPDDR4 memory controllers and includes an integrated display unit (DU). The component operates within a temperature range of -40°C to 85°C and features interfaces including USB 2.0 OTG, USB 3.0, Ethernet, CANbus, I2C, SPI, and MMC/SD/SDIO.

Feature Summary

  • Integrates heterogeneous multi-core architecture combining high-efficiency Cortex-A53 and high-performance Cortex-A57 processors for balanced computational loads.
  • Includes dedicated hardware display unit (DU) for video output processing without requiring external graphics accelerators.
  • Supports low-power LPDDR4 memory interface to enable efficient data throughput for embedded applications.

Applications

  • Industrial automation systems requiring robust real-time control and connectivity
  • Smart building infrastructure and digital signage solutions
  • Medical equipment utilizing embedded Linux or Android operating systems

Procurement Notes

Verify the specific suffix YJC against official Renesas documentation to confirm pinout compatibility and functional equivalence with standard variants like #G0. Ensure that design-in requirements match the specified package type and thermal characteristics. Confirm RoHS compliance status through current datasheets before finalizing procurement specifications.

Selection Notes

Select this component when a balance between power efficiency and processing performance is required for complex embedded tasks. The inclusion of both A53 and A57 cores allows for flexible task distribution. Verify that the target application can utilize the available peripheral interfaces such as USB 3.0 and multiple Ethernet ports effectively.

Part Context

This microprocessor belongs to the RZ/G2H family, designed for general-purpose embedded Linux and Android applications. It serves as a mid-range solution within the RZ/G2 lineup, offering more processing power than the RZ/G2E while consuming less power than higher-end models. The series targets cost-sensitive yet performance-demanding industrial and commercial markets.

Replacement Considerations

R8A774E0HA01BN#G0

R8A774E0HA01BN#YJCR8A774E0HA01BN#YJC
$151.17
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