Microprocessors R9A08G045S13GBG#BC0 product image

R9A08G045S13GBG#BC0

$11.87
  • Description:SOC RZ/G3S 14BGA NON-SECURE 1+1C
  • Series:RZ/G3S
  • Mfr:Renesas Electronics Corporation
  • Package:Tray

SKU:19c2be49a3b7 Category: Brand:

  
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R9A08G045S13GBG#BC0 is listed in the Microprocessors range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is SOC RZ/G3S 14BGA NON-SECURE 1+1C. Review the specifications below when checking this part for your BOM.

Microprocessors specifications for R9A08G045S13GBG#BC0

  • Description:SOC RZ/G3S 14BGA NON-SECURE 1+1C
  • Series:RZ/G3S
  • Mfr:Renesas Electronics Corporation
  • Package:Tray
  • Core Processor:ARM® Cortex®-A55
  • Number of Cores/Bus Width:1 Core, 64-Bit
  • Speed:1.1GHz
  • Co-Processors/DSP:ARM® Cortex®-M33
  • RAM Controllers:DDR4, LPDDR4
  • Graphics Acceleration:No
  • Display & Interface Controllers:-
  • Ethernet:10/100/1000Mbps (2)
  • SATA:-
  • USB:USB 2.0 OTG (2)
  • Voltage - I/O:1.8V, 3.3V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Security Features:-
  • Mounting Type:Surface Mount
  • Package / Case:361-LFBGA
  • Supplier Device Package:361-LFBGA (13x13)
  • Additional Interfaces:DMA, I2C, I2S, MMC/SD/SDIO, PCIe, SPI, UART
  • Grade:-
  • Qualification:-

Microprocessors datasheet and documents for R9A08G045S13GBG#BC0

R9A08G045S13GBG#BC0

Microprocessors Overview

The R9A08G045S13GBG#BC0 is a microprocessor unit (MPU) belonging to the RZ/G3S series manufactured by Renesas Electronics. It integrates an ARM Cortex-A55 application processor core and dual ARM Cortex-M33 real-time cores within a single system-on-chip architecture. The device supports 64-bit data processing with a maximum clock frequency of 1.1 GHz for the application core. It utilizes DDR4 or LPDDR4 memory interfaces and operates within a supply voltage range of 3.0 V to 3.6 V. The component is housed in a 361-ball PBGA package measuring 13x13 mm, designed for surface-mount installation.

Microprocessors Feature Summary

  • Integrates high-performance ARM Cortex-A55 application processing with dedicated dual-core ARM Cortex-M33 real-time control capabilities.
  • Supports advanced security features including AES encryption, ARM TrustZone, secure boot, and hardware random number generation.
  • Provides versatile connectivity options including Gigabit Ethernet, USB 2.0 OTG, and multiple serial communication interfaces.

Microprocessors Applications

  • Industrial automation systems requiring deterministic real-time control alongside application processing
  • Smart building infrastructure controllers
  • Advanced human-machine interface (HMI) panels

Microprocessors Procurement Notes

Verify the specific suffix against official Renesas documentation to confirm exact configuration details. Ensure compliance with export regulations if applicable. Confirm moisture sensitivity level handling requirements during storage and assembly. Validate DRAM compatibility using the manufacturer's approved list before finalizing design.

Microprocessors Selection Notes

Select this component when a unified solution for both high-level application logic and strict real-time task execution is required. The dual-core M33 subsystem allows offloading time-critical tasks from the main A55 core. Consider the 361-ball BGA package size and thermal dissipation characteristics for PCB layout planning.

Microprocessors Part Context

This part belongs to the RZ/G3S family, which targets mid-to-high-end embedded applications. The series emphasizes low power consumption and fast startup times while maintaining robust processing capabilities. It serves as a bridge between simple microcontrollers and complex application processors.

Microprocessors Replacement Considerations

Consult the official RZ/G3S product guide for pin-compatible or functionally equivalent alternatives within the same family. Verify that any substitute maintains the required security feature set and memory interface support.

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