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RAA2S4253B5HWT#FF1 is listed in the Sensor And Detector Interfaces range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is DIE ON FRAME. Review the specifications below when checking this part for your BOM.
The RAA2S4253B5HWT#FF1 is a signal conditioning integrated circuit from the Renesas RAA2S425x series, designed for automotive pressure sensing systems. It complies with ISO 26262 ASIL-B standards. The component operates within a temperature range of -40°C to +150°C and utilizes a QFN-24 package. It supports SMD/SMT mounting and interfaces via I2C. This specific suffix indicates a die-on-frame configuration intended for specialized packaging or integration.
Verify the exact physical form factor associated with the #FF1 suffix against official Renesas documentation, as it denotes a die-on-frame state rather than a standard packaged IC. Confirm export control classifications and RoHS compliance details directly with the manufacturer before procurement planning.
Select this component when designing automotive pressure sensors requiring ASIL-B compliance. Ensure the design accommodates the QFN-24 footprint if using the packaged variant, or verify die-level integration requirements for the FF1 suffix. Validate thermal management for the -40°C to +150°C operating range.
This part belongs to the RAA2S425x family of automotive sensor signal conditioners. Related variants include the RAA2S4253B5HNP#JA0 (QFN-24 tape & reel) and RAA2S4253B5HWT#FF0 (wafer unsawn). The family is optimized for xEV battery electric and fuel cell vehicle applications.
The RAA2S4253B5HNP#JA0 offers similar functionality in a standard QFN-24 tape and reel package. Verify pinout compatibility and electrical specifications against the datasheet before substituting the die-on-frame version with a packaged alternative.
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