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The RB088BM-30FNSTL is a silicon epitaxial planar Schottky barrier diode manufactured by ROHM Semiconductor. It features a cathode common dual configuration within a TO-252 (DPAK) surface-mount package. The device supports a repetitive peak reverse voltage of 35 V and a standard reverse voltage of 30 V. It provides an average rectified forward current of 10 A per diode under specified thermal conditions, with a maximum peak forward surge current of 50 A. Electrical characteristics include a maximum forward voltage of 0.72 V at 5 A and a maximum reverse current of 3 μA at 30 V. The component operates with a junction temperature range up to 175 °C.
Verify the specific ordering suffix 'TL' corresponds to the embossed tape reel packaging format containing 2500 units per reel. Confirm that the marking code 'B088BM30' matches the physical components received. Ensure the procurement documentation references the correct datasheet revision to validate electrical parameters against the manufacturing date.
Select this component for applications requiring a dual Schottky diode in a compact surface-mount form factor. The low forward voltage drop contributes to reduced power dissipation. Verify that the thermal resistance specifications align with the system's heat dissipation capabilities to maintain the junction temperature within the 175 °C limit during operation.
This part belongs to the RB088BM series of Schottky barrier diodes from ROHM Semiconductor. The series utilizes silicon epitaxial planar technology designed for high reliability. The RB088BM-30FNS variant specifically targets general-purpose switching applications where low forward voltage and high surge current handling are required in a DPAK package.
Publicly confirmed substitute part numbers are not available in the provided documentation.
The maximum operating junction temperature is 175 °C.
The device contains two elements configured as a cathode common dual type.
The maximum reverse current is 3 μA when measured at a reverse voltage of 30 V.