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The RB218BM200TL is a Schottky barrier diode manufactured by ROHM Semiconductor, housed in a TO-252-3 (D-Pak) surface-mount package. It features a dual anode common cathode configuration with a 200 V repetitive reverse voltage rating and a 20 A average forward current capability. The device exhibits a maximum forward voltage of 880 mV at 10 A and a low reverse leakage current of 10 uA at 200 V. It supports a 100 A surge current and operates up to a junction temperature of +150 °C. This component is AEC-Q101 qualified for automotive applications.
Verify the specific suffix 'TL' against the official datasheet to confirm the tape and reel packaging quantity and orientation. Confirm the RoHS compliance status and REACH SVHC declarations as these attributes are subject to regulatory updates. Ensure the procurement channel provides traceability documentation required for AEC-Q101 qualified components used in automotive or industrial sectors.
Select this component when a dual Schottky configuration is required in a D-Pak package with high current handling capabilities. Consider the 200 V rating and 20 A continuous current limits relative to the application's peak load requirements. Evaluate the thermal management needs given the +150 °C junction temperature limit and the specific thermal resistance characteristics of the TO-252-3 package.
This part belongs to the RBxx8 series of ultra-low IR Schottky barrier diodes from ROHM. The series is engineered to address the traditional limitation of Schottky diodes regarding reverse leakage current increase at high temperatures. By employing advanced blocking metal structures, the RBxx8 series maintains stable performance in automotive and industrial applications where thermal stability is paramount.
The RB218BM200FHTL is listed as a similar level replacement with the same pinout and package. Verify if the 'FH' suffix indicates any differences in packaging or marking before substitution. Other variants in the RB218BM200 family may offer different packaging options such as cut tape or bulk, which should be checked for compatibility with assembly processes.