SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The RB480KS-TP is a Schottky barrier rectifier manufactured by Micro Commercial Components (MCC). It features an average forward rectified current of 4.0 A and a maximum repetitive peak reverse voltage of 80 V. The device utilizes a low-profile SMA (DO-214AC) surface-mount package, designed for high-efficiency power conversion applications. Key electrical characteristics include a maximum DC blocking voltage of 80 V and a maximum RMS voltage of 56 V. The component is constructed using silicon epitaxial planar technology with a metal-semiconductor junction to ensure fast switching speeds and minimal reverse recovery time.
Verify the specific suffix 'KS' against the official MCC datasheet to confirm package variant and marking details. Ensure the ordering part number matches the required tape-and-reel or cut-tape configuration. Cross-reference the manufacturer's latest revision history to confirm compliance with current RoHS directives and halogen-free status before finalizing procurement specifications.
Select this component when a surface-mount Schottky rectifier with a 4.0 A continuous current rating and 80 V reverse voltage capability is required. The SMA package offers a balance between current handling and footprint size. Consider thermal derating curves for high ambient temperature environments. Verify that the low forward voltage drop characteristic aligns with the efficiency requirements of the target power supply topology.
This component belongs to the RB480 series of Schottky barrier rectifiers from Micro Commercial Components. The series is characterized by its use of silicon epitaxial planar technology and metal-semiconductor junctions. These devices are specifically engineered to replace conventional fast-recovery diodes in applications where speed and efficiency are critical, offering reduced power loss during switching transitions.
The maximum operating junction temperature is specified as +175°C according to the absolute maximum ratings.
No, the RB480KS-TP is a discrete semiconductor device in an SMA package. Thermal management relies on PCB copper area and external circuit design.