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RD3N01BATTL1 is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Rohm Semiconductor. Its product description is PCH -80V -10A TO-252, POWER MOSF. Review the specifications below when checking this part for your BOM.
The RD3N01BATTL1 is a single-channel P-Channel Power MOSFET manufactured by ROHM Semiconductor, housed in a TO-252-3 surface-mount package. It features an 80 V drain-source breakdown voltage and supports a continuous drain current of 10 A. The device exhibits a maximum on-resistance of 163 mOhms at a gate-source voltage of -4.5 V. Electrical characteristics include a gate threshold voltage of 4 V, a total gate charge of 21 nC, and a power dissipation rating of 25 W. Operating temperatures range from -55 C to +150 C.
Verify the complete part number including the TL1 suffix to ensure correct reel packaging specifications. Confirm RoHS compliance status through official manufacturer documentation prior to integration. Cross-reference the datasheet for specific thermal resistance values required for your heat sink design. Ensure gate drive voltages remain within the specified -20 V to +20 V limits to prevent device damage.
Select this component when a P-Channel solution is preferred over N-Channel alternatives in high-side switching applications. The 80 V rating suits systems operating below this threshold with adequate safety margins. Consider the 163 mOhm on-resistance for efficiency requirements at 10 A loads. Evaluate the TO-252 package suitability against available PCB real estate and thermal management capabilities.
This device belongs to ROHM's RD3N series of power MOSFETs designed for general-purpose switching. The series emphasizes low on-resistance and fast switching speeds within standard surface-mount packages. The RD3N01BATTL1 variant specifically targets applications requiring moderate voltage blocking and current handling capabilities.
Consult official substitution guides for equivalent P-Channel MOSFETs with matching voltage and current ratings. Verify pinout compatibility and thermal characteristics before replacing the original component.
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