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The REF35125YBHR is a series voltage reference IC from Texas Instruments. It provides a fixed output voltage of 1.25 V with an initial accuracy of ±0.05% and a maximum temperature coefficient of 12 ppm/°C. The device operates with a typical quiescent current of 650 nA and supports a maximum load current of 10 mA. It functions within an input voltage range up to 5.5 V and operates across a temperature range of -40°C to +125°C. The component is housed in a 4-DSBGA package.
Verify the specific suffix YBHR against the official Texas Instruments datasheet to confirm package type and tape/reel specifications. Ensure compatibility with your PCB footprint, as the 4-DSBGA package requires precise soldering techniques. Cross-reference the manufacturer part number with authorized distributors to avoid counterfeit components. Confirm that the required operating temperature range meets your application's environmental constraints before finalizing procurement.
Select this component when ultra-low power consumption is critical alongside high precision requirements. The 1.25 V output is suitable for low-voltage ADC references. Consider the small 4-DSBGA package size if board real estate is limited. Compare the 650 nA quiescent current against other series references to ensure it meets system-level power budgets. Verify that the 10 mA load capability is sufficient for your specific circuit demands.
The REF35125YBHR belongs to the REF35 family of ultra-low-power, high-precision voltage references. This series is designed for applications requiring minimal current draw without sacrificing accuracy. The REF35 line typically includes various output voltages and packages, catering to diverse portable and industrial needs. The YBHR suffix specifically denotes the 4-DSBGA package variant within this product family.
Check for direct pin-compatible substitutes within the REF35 family or other TI series references like the REF3xxx series. Verify that any replacement matches the 1.25 V output, ±0.05% accuracy, and 650 nA quiescent current specifications. Ensure the alternative component offers similar thermal performance and package dimensions for seamless integration.