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RHEF1000-2 is listed in the Ptc Resettable Fuses range at ChipApex. The manufacturer field lists Littelfuse Inc.. Its product description is PTC RESET FUSE 16V 10A RADIAL. Review the specifications below when checking this part for your BOM.
The Littelfuse RHEF1000-2 is a PolySwitch resettable PTC fuse designed for overcurrent protection in low-voltage circuits. It features a maximum voltage rating of 16 VDC and a hold current (Ih) of 10 A. The trip current (It) is specified at 18.5 A, with a maximum fault current rating of 100 A. Initial resistance (Ri) is typically 6.2 mOhms, while post-trip resistance (R1) has a maximum of 15 mOhms. The device operates within a temperature range of -40°C to +125°C and utilizes a radial, disc-style through-hole package.
Verify that the specific ordering suffix matches the required packaging format, such as tape-and-reel or cut-strip, as these affect handling and assembly processes. Confirm that the component status remains active and check for any recent product change notifications regarding material composition or certification updates before finalizing procurement orders.
Select this component when circuit protection is required for applications operating at voltages up to 16 VDC with continuous currents around 10 A. Ensure the expected fault current does not exceed the 100 A maximum rating. Consider the radial leaded form factor for through-hole mounting requirements and verify that the operating temperature range aligns with the environmental conditions of the target application.
The RHEF1000-2 belongs to the PolySwitch RHEF series of resettable fuses manufactured by Littelfuse Inc. This series is engineered to provide solid-state overcurrent protection solutions. The component serves as a reusable alternative to traditional one-time fuses, offering durability and cost savings in applications where repeated fault events may occur.
Direct substitutes include part numbers such as RHEF1000 and RHEF1000-2HFTR, which share similar electrical characteristics and form factors. Verify compatibility with existing board layouts and thermal management requirements when transitioning between different packaging variants within the same series.
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