RHRG3060CC

Description：DIODE ARR AVAL 600V 30A TO247-3
Series：-

SKU:66207156812a Category: Diode Arrays Brand: onsemi

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Product introduction

Product Detailed Parameters

Description：DIODE ARR AVAL 600V 30A TO247-3
Series：-
Mfr：onsemi
Package：Tube
Diode Configuration：1 Pair Common Cathode
Technology：Avalanche
Voltage - DC Reverse (Vr) (Max)：600 V
Current - Average Rectified (Io) (per Diode)：30A
Voltage - Forward (Vf) (Max) @ If：2.1 V @ 30 A
Speed：Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr)：45 ns
Current - Reverse Leakage @ Vr：250 µA @ 600 V
Operating Temperature - Junction：-65°C ~ 175°C
Mounting Type：Through Hole
Package / Case：TO-247-3
Supplier Device Package：TO-247-3
Grade：-
Qualification：-

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RHRG3060CC

Overview

The RHRG3060CC is a small signal switching diode manufactured by onsemi, housed in a TO-247 through-hole package. It features a dual configuration with a peak reverse voltage of 600 V and a maximum forward current of 30 A. The device supports a peak surge current of 325 A and exhibits a recovery time of 45 ns. Forward voltage is rated at 2.1 V, while reverse current is limited to 250 uA. Operating temperatures range from -65 C to +175 C.

Feature Summary

Dual configuration for versatile circuit integration
High thermal stability supporting extended temperature ranges
Robust surge current handling capability

Applications

High-frequency switching circuits
Power supply rectification
Industrial control systems

Procurement Notes

Verify component authenticity through authorized channels due to end-of-life status. Confirm RoHS compliance documentation availability. Check specific manufacturing lot dates against project requirements. Ensure packaging integrity matches original specifications. Validate datasheet revisions for any parameter updates prior to final design approval.

Selection Notes

Evaluate thermal management requirements given the TO-247 package constraints. Compare recovery time specifications against target switching frequencies. Assess forward voltage drop impact on overall system efficiency. Consider alternative packages if board space limitations exist. Verify compatibility with existing heat sinking infrastructure.

Part Context

This component belongs to onsemi's general purpose power diode lineup. It serves as a high-reliability solution for demanding power electronics applications. The dual configuration allows for bridge or push-pull topologies without additional components.