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The RN2113ACT(TPL3) is a bias resistor built-in transistor (BRT) manufactured by Toshiba Semiconductor and Storage. It integrates a single NPN bipolar junction transistor with two internal resistors in a compact surface-mount package. The device features a collector-emitter voltage rating of 50V and a continuous collector current capacity of 100mA. Internal resistance values are typically configured as R1 at 47kΩ and R2 at 47kΩ, providing a fixed bias ratio. This component is designed for switching applications, offering simplified circuit design by eliminating external biasing components while maintaining reliable performance in low-power digital logic interfaces.
Verify the exact suffix TPL3 against the manufacturer's latest datasheet to confirm tape-and-reel packaging specifications and moisture sensitivity level. Ensure the ordering code matches the required resistance tolerance and hFE binning. Cross-reference the RoHS compliance status with current environmental regulations for your target market before finalizing procurement orders.
Select this component when a compact NPN solution with integrated 47kΩ/47kΩ biasing is required. Compare the 50V Vceo and 100mA Ic limits against the load requirements. Consider the SC-88 or SOT-323 footprint availability if space constraints exist. Verify thermal dissipation capabilities under continuous duty cycles to ensure operation remains within the specified junction temperature range.
This part belongs to Toshiba’s RN series of bias resistor built-in transistors, which are widely used in automotive and industrial applications. The RN2113 variant specifically denotes an NPN configuration with equal base and emitter resistor values. The TPL3 suffix indicates specific packaging and handling attributes defined by Toshiba for automated surface-mount assembly processes.
Direct substitutes include other NPN BRTs with similar 50V ratings and 47kΩ/47kΩ internal resistances, such as the RN2113MFV or equivalent parts from other manufacturers like ROHM or ON Semiconductor. Verify pinout compatibility and package dimensions before substitution.