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The RN2302,LXHF is a PNP pre-biased bipolar junction transistor (BJT) manufactured by Toshiba Semiconductor and Storage. It integrates base resistor R1 (10 kΩ) and emitter resistor R2 (10 kΩ) within an SC-70 (SOT-323/USM) surface-mount package. Key electrical specifications include a collector-emitter breakdown voltage of 50 V, a maximum collector current of 100 mA, and a transition frequency of 200 MHz. The device features a maximum power dissipation of 100 mW, a DC current gain (hFE) of 50 at 10 mA and 5 V, and a saturated voltage drop of 300 mV at specific test conditions.
Verify the exact suffix against official Toshiba documentation, as LXHF may denote specific tape-and-reel or automotive-grade variants distinct from standard LF versions. Confirm RoHS compliance status and lead times directly with authorized distributors. Ensure the ordering part number matches the required package type and internal resistance values specified in the datasheet before finalizing procurement orders.
Select this component for applications requiring compact PNP switching solutions with integrated biasing. The SC-70 package suits space-constrained designs. Verify that the 50 V rating and 100 mA current capacity meet the load requirements. Consider the 200 MHz transition frequency for high-speed switching needs. Ensure thermal management supports the 100 mW power dissipation limit in the intended enclosure.
This component belongs to Toshiba's RN series of Bias Resistor Built-in Transistors (BRT). These devices combine a single BJT with internal resistors to reduce board space and assembly complexity. The RN2302 variant specifically utilizes a PNP configuration, distinguishing it from NPN counterparts like the RN21xx series. This family is designed to streamline interface and driver circuit implementations.
Publicly confirmed substitute part numbers are not available in the provided source material. Cross-reference with other manufacturers' pre-biased PNP transistors only if pinout compatibility and electrical parameters match exactly. Verify package dimensions and thermal characteristics when considering alternative sources.