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RTBS30M-TP is listed in the Bridge Rectifier range at ChipApex. The manufacturer field lists MCC (Micro Commercial Components). Its product description is BRIDGE RECT 1PHASE 1KV 3A 4-TBS. Review the specifications below when checking this part for your BOM.
The RTBS30M-TP is a single-phase glass-passivated bridge rectifier manufactured by Micro Commercial Components. It features a maximum repetitive peak reverse voltage of 1000V and an average forward current rating of 3.0A at a case temperature of 110°C. The device exhibits a maximum instantaneous forward voltage of 1.30V at 1.5A and a typical junction capacitance of 38pF. Maximum reverse recovery time is specified at 350ns under defined test conditions. Thermal resistance values are 10°C/W from junction to case, 15°C/W from junction to lead, and 55°C/W from junction to ambient.
Verify the specific ordering suffix to confirm packaging configuration. The standard designation indicates tape and reel packaging containing 3000 pieces per reel. Ensure procurement channels are authorized distributors to guarantee genuine parts with full traceability and adherence to handling standards.
Select this component when applications demand a 1000V blocking voltage combined with a 3A continuous current rating. Consider the 350ns reverse recovery time for switching frequency requirements. Evaluate thermal management needs based on the specified junction-to-case thermal resistance values for the operating environment.
This part belongs to the TBS series of fast recovery bridge rectifiers from Micro Commercial Components. The series offers various voltage ratings within the same physical footprint, allowing for design flexibility. The RTBS30M specifically targets high-voltage applications requiring robust surge handling and efficient power conversion.
Cross-reference with other 3A, 1000V single-phase bridge rectifiers in the 4-TBS package. Verify that substitute components match or exceed the 350ns reverse recovery time and 1.30V forward voltage specifications. Confirm pinout compatibility and thermal resistance parameters before implementation.
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