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RZR040P01TL is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Rohm Semiconductor. Its product description is MOSFET P-CH 12V 4A TSMT3. Review the specifications below when checking this part for your BOM.
The RZR040P01TL is a silicon P-channel enhancement-mode MOSFET manufactured by ROHM Semiconductor. It features a TSMT3 surface-mount package with three terminals. Key electrical parameters include a drain-source voltage of -12 V and a continuous drain current of -4 A. The device exhibits a typical on-resistance of 0.04 Ω at a gate-source voltage of 1.5 V, supporting low-voltage drive applications. Total gate charge is specified at 37 nC, with power dissipation rated at 0.8 W. Operating temperatures range from -55 °C to +150 °C.
Verify the specific suffix TL against official datasheets to confirm tape-and-reel packaging specifications. Ensure compatibility with RoHS standards and check for any obsolescence notices, as some related models in this series may be marked as non-recommended for new designs. Confirm thermal management requirements align with the 0.8 W power dissipation rating under intended operating conditions.
Select this component when a P-channel MOSFET requires operation with a 1.5 V drive signal while maintaining low on-resistance. The TSMT3 package offers a small footprint compared to larger alternatives. Consider the -12 V breakdown voltage limit and -4 A current capacity to ensure adequate headroom for the target application's load requirements.
This part belongs to ROHM's lineup of low-voltage drive P-channel MOSFETs. It shares design similarities with other members like RAF040P01 but utilizes the TSMT3 package variant. These devices are engineered to replace standard logic-level MOSFETs in systems where lower gate drive voltages are available or required to reduce power consumption.
Direct substitutes within the same family include RAF040P01TCL, which shares identical electrical characteristics but may differ in packaging details. Verify pinout compatibility and thermal resistance values before swapping components in existing layouts.
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