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Product Detailed Parameters
- Description：DIODE ARRAY GP 75V 400MA 8-SOIC
- Series：-
- Mfr：Microchip Technology
- Package：Tape & Reel (TR)
- Diode Configuration：4 Independent
- Technology：Standard
- Voltage - DC Reverse (Vr) (Max)：75 V
- Current - Average Rectified (Io) (per Diode)：400mA (DC)
- Voltage - Forward (Vf) (Max) @ If：1.2 V @ 100 mA
- Speed：Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr)：5 ns
- Current - Reverse Leakage @ Vr：100 nA @ 50 V
- Operating Temperature - Junction：-55°C ~ 150°C
- Mounting Type：Surface Mount
- Package / Case：8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package：8-SOIC
- Grade：-
- Qualification：-
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Overview
The S8-4148E3/TR7 is a diode array manufactured by Microchip Technology, designed for signal or computer applications. It features an octal configuration with four independent diodes and four lines. The device supports a maximum forward current of 400 mA and withstands a breakdown voltage of 90 V. Packaged in an SOIC-16 surface-mount format, it operates within a temperature range of -55 °C to +150 °C. Key electrical characteristics include a reverse current of 500 nA and a forward voltage of 1.2 V.
Feature Summary
- Octal configuration providing four independent diode lines within a single package
- High-speed switching capability with a recovery time of 5 ns
- Extended thermal stability suitable for demanding industrial environments
Applications
- Signal processing circuits requiring fast switching
- Computer logic interface protection
- General-purpose diode arrays in electronic systems
Procurement Notes
Verify the specific suffix TR7 against official Microchip documentation to confirm reel packaging specifications. Ensure compatibility with SOIC-16 footprint requirements during PCB layout. Confirm RoHS compliance status through the manufacturer's product compliance database prior to integration into regulated assemblies.
Selection Notes
Select this component when an octal diode array is required for compact signal routing. The SOIC-16 package facilitates automated surface-mount assembly. Consider the 90 V breakdown rating and 400 mA forward current limits to ensure adequate headroom for the target application's electrical stress conditions.
Part Context
This part belongs to Microchip Technology's high-reliability discrete semiconductor portfolio. It serves as a specialized solution for complex logic and signal conditioning tasks where multiple isolated diode functions are necessary within a constrained board area.
Replacement Considerations
Consult Microchip's official comparable parts tool for verified substitutes. Cross-reference pinouts and electrical ratings carefully before substituting with generic market alternatives.
