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S912ZVLA12ACLC is listed in the Microcontrollers range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is S12Z CPU, 128K FLASH. Review the specifications below when checking this part for your BOM.
The S912ZVLA12ACLC is a 16-bit microcontroller from NXP Semiconductors, based on the S12Z CPU core. It features 128 kB of Flash program memory and 8 kB of SRAM data RAM. The device operates with a maximum clock frequency of 32 MHz and supports a supply voltage range of 5.5 V to 18 V. It includes a 12-bit ADC with 10 channels and an 8-bit DAC. Communication interfaces include CAN, LIN, SCI, and SPI. The unit is housed in a 32-pin LQFP package and functions within a temperature range of -40°C to +85°C.
Verify the specific suffix ACLC against official NXP documentation to confirm the exact package type and temperature grade. Ensure compatibility with existing board layouts for the LQFP-32 footprint. Confirm that the 5.5 V to 18 V operating range aligns with the target system power design. Check for any regional distribution restrictions or obsolescence notices prior to finalizing procurement plans.
Select this component when a 16-bit architecture with integrated high-voltage tolerance is required. The S12Z core offers efficient processing for mixed-signal tasks. Consider the 128 kB Flash capacity for complex application code. Evaluate the 32 MHz speed against real-time processing requirements. Ensure the LQFP-32 package fits the mechanical constraints of the assembly.
This part belongs to the S12ZVL family of mixed-signal microcontrollers designed for automotive and industrial markets. The series emphasizes robustness and integration for motor control and body electronics. The S912ZVLA12ACLC represents a specific configuration within this lineage, balancing memory size with peripheral count.
Consult NXP datasheets for direct pin-compatible alternatives within the S12ZVL family. Verify memory sizes and interface availability when substituting. Cross-reference suffix codes to ensure identical package and temperature specifications.
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