SA58631TK,115

Overview

The SA58631TK,115 is a single-channel audio amplifier housed in an HVSON8 package with an exposed die attach paddle. It delivers 3 W output power to an 8 Ω load at a 9 V supply voltage. The internal circuit comprises a Bridge Tied Load (BTL) amplifier with a complementary PNP-NPN output stage and standby/mute logic. Operating supply voltage ranges from 2.2 V to 18 V. Quiescent current is typically 8 mA, while standby current is less than 10 μA. The device features low junction-to-ambient thermal resistance and high power supply ripple rejection.

Feature Summary

• Bridge Tied Load (BTL) architecture with complementary PNP-NPN output stage
• Low standby current consumption controlled by CMOS-compatible levels
• Integrated protection against output short circuits and thermal overload
• High power supply ripple rejection capability

Applications

• Professional and amateur mobile radio systems
• Portable consumer products such as toys and games
• Personal computer remote speakers

Procurement Notes

Verify the specific ordering suffix for the SA58631TK,115 variant against official NXP documentation to confirm packaging details and material declarations. Confirm that the component status aligns with current manufacturing availability, as older revisions may indicate discontinued status. Ensure compatibility with required lead-free soldering processes and moisture sensitivity levels specified in the datasheet.

Selection Notes

Select this amplifier for applications requiring a single-channel BTL configuration with moderate power output. The device supports gain adjustment via external resistors ranging from 6 dB to 30 dB. Consider the exposed die attach paddle for thermal management when designing PCB layouts. Verify that the operating voltage range and load impedance requirements match the system specifications.

Part Context

The SA58631 belongs to NXP's portfolio of audio amplifiers designed for portable and mobile applications. It utilizes an HVSON8 plastic thermal enhanced very thin small outline package. This package type facilitates efficient heat dissipation through an exposed die attach paddle, allowing for higher power density in compact designs compared to standard packages without thermal pads.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided source material.