SAA6588/V2,112

SAA6588/V2,112

  • Description:IC RDS/RBDS PRE-PROCESSOR 20DIP
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tube

SKU:538c638431a8 Category: Brand:

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Product Detailed Parameters

  • Description:IC RDS/RBDS PRE-PROCESSOR 20DIP
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tube
  • Function:Pre-Processor
  • Frequency:57kHz
  • RF Type:-
  • Secondary Attributes:-
  • Mounting Type:Through Hole
  • Package / Case:20-DIP (0.300", 7.62mm)
  • Supplier Device Package:20-DIP
  • Grade:-
  • Qualification:-

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SAA6588/V2,112

Overview

The SAA6588/V2,112 is an integrated circuit designed as an RDS/RBDS pre-processor manufactured by NXP USA Inc. It operates within a supply voltage range of 4.5 V to 5.5 V and functions reliably across an industrial temperature spectrum from -40 °C to +85 °C. The component is housed in a 20-pin plastic DIP package with rectangular inline configuration, measuring 26.73 mm in length and 4.2 mm in maximum height. It is classified as a consumer circuit intended for radio data system signal processing applications.

Feature Summary

  • Performs pre-processing for Radio Data System (RDS) and Radio Broadcast Data Service (RBDS) signals
  • Operates on standard 5V logic supply levels
  • Designed for integration into consumer electronic audio equipment

Applications

  • FM radio receiver systems requiring RDS decoding
  • Consumer audio devices incorporating radio broadcast data services
  • Embedded systems utilizing RBDS information transmission

Procurement Notes

Verify the specific suffix /V2,112 against official NXP documentation to confirm package type and environmental compliance status. Ensure compatibility with existing 5V power rails and DIP-20 footprint requirements. Confirm current availability status as distribution channels may vary for discontinued or legacy components.

Selection Notes

Select this component when designing FM receivers that require dedicated hardware for RDS/RBDS signal conditioning prior to microcontroller processing. The 20-DIP package facilitates prototyping and through-hole manufacturing processes. Verify thermal management capabilities for operation within the specified -40 °C to +85 °C range in enclosed consumer enclosures.

Part Context

This part belongs to the SAA65 series of RF and wireless ICs produced by NXP. It serves as a specialized pre-processor distinct from demodulators like the SAA6579. The component addresses the specific need for handling radio broadcast data streams in consumer electronics, complementing broader RF front-end solutions.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Users should consult NXP directly for obsolescence management or functional equivalents.

SAA6588/V2,112SAA6588/V2,112

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