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The SAA6588/V2,112 is an integrated circuit designed as an RDS/RBDS pre-processor manufactured by NXP USA Inc. It operates within a supply voltage range of 4.5 V to 5.5 V and functions reliably across an industrial temperature spectrum from -40 °C to +85 °C. The component is housed in a 20-pin plastic DIP package with rectangular inline configuration, measuring 26.73 mm in length and 4.2 mm in maximum height. It is classified as a consumer circuit intended for radio data system signal processing applications.
Verify the specific suffix /V2,112 against official NXP documentation to confirm package type and environmental compliance status. Ensure compatibility with existing 5V power rails and DIP-20 footprint requirements. Confirm current availability status as distribution channels may vary for discontinued or legacy components.
Select this component when designing FM receivers that require dedicated hardware for RDS/RBDS signal conditioning prior to microcontroller processing. The 20-DIP package facilitates prototyping and through-hole manufacturing processes. Verify thermal management capabilities for operation within the specified -40 °C to +85 °C range in enclosed consumer enclosures.
This part belongs to the SAA65 series of RF and wireless ICs produced by NXP. It serves as a specialized pre-processor distinct from demodulators like the SAA6579. The component addresses the specific need for handling radio broadcast data streams in consumer electronics, complementing broader RF front-end solutions.
Publicly confirmed substitute part numbers are not available in the provided documentation. Users should consult NXP directly for obsolescence management or functional equivalents.