SAC3058

RF Amplifiers Overview

The SAC3058 is a GaAs MMIC low noise amplifier die designed for radar applications. It operates within a frequency range of 1GHz to 9GHz. Key electrical parameters include a gain of 21dB, an output P1dB of 19dBm, and a noise figure of 1.1dB. The device requires a supply voltage of 5V and draws a supply current of 65mA. This component is supplied as a bare die.

RF Amplifiers Feature Summary

• GaAs MMIC technology for high-frequency performance
• Optimized for radar system integration
• Low noise figure specification for signal integrity

RF Amplifiers Applications

• Radar systems
• RF front-end modules
• Microwave communication links

RF Amplifiers Procurement Notes

Verify the specific datasheet version and application notes provided by SuperApex, LLC or authorized distributors. Confirm that the receiving facility has the necessary infrastructure for handling bare die components, including appropriate mounting and wire bonding capabilities. Ensure compliance with RoHS standards if required by the end product specifications.

RF Amplifiers Selection Notes

Select this component when a wideband LNA covering 1GHz to 9GHz is required for radar or microwave applications. Consider the bare die format for custom module integration where space constraints are critical. Evaluate the 1.1dB noise figure against system sensitivity requirements and ensure the 5V supply rail aligns with the overall power budget.

RF Amplifiers Part Context

SuperApex, LLC specializes in RF, microwave, and millimeter-wave components, particularly GaAs MMICs. The SAC3058 represents their capability in providing high-performance amplifier solutions for demanding wireless and radar environments. The company offers various chip packaging and module options alongside discrete MMIC dies.

RF Amplifiers Replacement Considerations

No public confirmed substitute part numbers are available for the SAC3058. Due to the specific GaAs MMIC design and unique parameter set, direct replacements may require re-verification of electrical characteristics and physical footprint compatibility.