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SBRA140T3 is listed in the Controllers range at ChipApex. The manufacturer field lists onsemi. Its product description is REC SMA SPECIAL SHTKY. Review the specifications below when checking this part for your BOM.
The SBRA140T3G is a surface-mount Schottky barrier rectifier manufactured by onsemi, designed for low voltage and high frequency applications. It features a single diode configuration in a DO-214AA (SMB) package with two pins. Key electrical parameters include a maximum repetitive peak reverse voltage of 40 V and a continuous forward current rating of 1 A. The device exhibits a typical forward voltage drop of 600 mV at rated current and supports a peak non-repetitive forward surge current of 40 A. Operating temperature ranges from -55°C to +125°C, ensuring reliability in compact systems where size and weight are critical constraints.
Verify the specific suffix against official datasheets, as variations may indicate automotive qualification or packaging differences. Confirm RoHS compliance status through manufacturer documentation. Ensure the ordering part number matches the required package type and voltage rating for the target application design.
Select this component for applications requiring low forward voltage drop and fast switching characteristics in space-constrained designs. Compare performance metrics such as reverse leakage current and thermal resistance against alternative Schottky rectifiers. Ensure the 40 V reverse voltage rating provides sufficient margin for the circuit's peak inverse voltage conditions.
This component belongs to onsemi’s SBRA series of surface mount Schottky power rectifiers. The series is engineered for efficient power conversion in modern electronic devices. The SBRA140T3 variant specifically targets general-purpose rectification needs within the SMB package footprint, balancing current handling capabilities with compact form factors.
Direct substitutes include MBRA140T3G and SBRS8140T3G from onsemi, which share similar electrical ratings and package types. Verify pinout compatibility and thermal characteristics when replacing components in existing PCB layouts.
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