SE97BTP,547

SE97BTP,547

$0.94
  • Description:IC TEMP SENSOR DIMM 8HWSON
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:53c1e91021ab Category: Brand:

  
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Product Detailed Parameters

  • Description:IC TEMP SENSOR DIMM 8HWSON
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Function:Temp Monitoring System (Sensor), DIMM DDR Memory
  • Sensor Type:Internal
  • Sensing Temperature:-40°C ~ 125°C
  • Accuracy:±3°C(Max)
  • Topology:ADC (Sigma Delta), Comparator, Register Bank
  • Output Type:I2C/SMBus
  • Output Alarm:Yes
  • Output Fan:Yes
  • Voltage - Supply:3V ~ 3.6V
  • Operating Temperature:-40°C ~ 125°C
  • Grade:-
  • Qualification:-
  • Mounting Type:Surface Mount
  • Package / Case:8-WFDFN Exposed Pad
  • Supplier Device Package:8-HWSON (2x3)

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SE97BTP,547

Overview

The SE97BTP,547 is a board-mount digital temperature sensor designed for DDR memory modules. It operates within a supply voltage range of 3 V to 3.6 V and features an I2C/SMBus interface. The device provides local temperature monitoring with an accuracy of ±3°C across a working temperature range of -40°C to +125°C. It includes a programmable temperature threshold and shutdown capability. The component utilizes an 8-HWSON (2x3) package and incorporates 256 bytes of EEPROM for storing module information.

Feature Summary

  • Integrated 256-byte EEPROM for serial presence detection data storage
  • Compliant with JEDEC Grade B specifications for critical temperature regions
  • Supports I2C bus and SMBus communication protocols
  • Features programmable temperature thresholds and shutdown mode

Applications

  • DDR3 dual in-line memory module (DIMM) temperature monitoring
  • Mobile platform memory module thermal management
  • DRAM temperature measurement per JC-42.4 specifications

Procurement Notes

Verify the specific suffix code to confirm package type and tape/reel configuration. Confirm RoHS compliance status through official manufacturer documentation. Check current lifecycle status as availability may vary by region. Ensure ESD handling procedures are followed due to moisture sensitivity classification.

Selection Notes

Select this component when designing DDR memory systems requiring integrated thermal sensing and SPD functionality. The 8-pin HWSON package suits space-constrained PCB layouts. Verify interface compatibility with the host controller's I2C or SMBus capabilities before integration.

Part Context

This part belongs to the NXP SE97 series of temperature sensors specifically engineered for memory applications. It replaces traditional standalone SPD chips by combining thermal monitoring with data storage. The series supports various DDR standards, ensuring compatibility with modern mobile and desktop memory architectures.

Replacement Considerations

SE97TP,547: Similar function but different accuracy specifications. SE98ATP,547: Higher accuracy variant with different voltage requirements.

SE97BTP,547SE97BTP,547
$0.94
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