SE97PW,118

SE97PW,118

  • Description:IC TEMP SENSOR DIMM 8-TSSOP
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)

SKU:6b79fbda5311 Category: Brand:

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Product Detailed Parameters

  • Description:IC TEMP SENSOR DIMM 8-TSSOP
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)
  • Function:Temp Monitoring System (Sensor), DIMM DDR Memory
  • Sensor Type:Internal
  • Sensing Temperature:-40°C ~ 125°C
  • Accuracy:±3°C(Max)
  • Topology:ADC (Sigma Delta), Comparator, Register Bank
  • Output Type:I2C/SMBus
  • Output Alarm:Yes
  • Output Fan:Yes
  • Voltage - Supply:3V ~ 3.6V
  • Operating Temperature:-40°C ~ 125°C
  • Grade:-
  • Qualification:-
  • Mounting Type:Surface Mount
  • Package / Case:8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Supplier Device Package:8-TSSOP

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SE97PW,118

Overview

The SE97PW,118 is a temperature monitoring system sensor designed for DIMM DDR memory applications. Manufactured by NXP USA Inc., this component operates within an internal sensor range of -40°C to 125°C. It features I2C/SMBus output capabilities and is housed in an 8-TSSOP package with dimensions of 0.118 inches (3.00mm) width.

Feature Summary

  • Integrated internal sensor for precise thermal monitoring
  • Compatible with I2C and SMBus communication protocols
  • Optimized for DIMM DDR memory environments

Applications

  • DIMM DDR memory thermal management
  • System temperature monitoring
  • Thermal protection circuits

Procurement Notes

Verify the specific ordering suffix and package variant against official NXP documentation before procurement. Ensure compatibility with existing I2C/SMBus bus configurations and voltage levels. Confirm that the 8-TSSOP footprint matches the target PCB design requirements for proper integration.

Selection Notes

Select this component when dedicated thermal monitoring for DDR memory modules is required. The integrated sensor simplifies board layout by eliminating external thermistors. Verify that the operating temperature range meets the environmental specifications of the final assembly.

Part Context

This device belongs to NXP's thermal management portfolio, focusing on reliable temperature sensing for high-speed digital interfaces. It supports system stability by providing real-time data to prevent overheating in memory subsystems.

Replacement Considerations

Consult official NXP substitution guides for verified alternatives. Cross-reference pinouts and electrical characteristics to ensure functional equivalence without redesigning the host circuit.

SE97PW,118SE97PW,118

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