SFH601-3X002

Overview

The SFH601-3X002 is a single-channel transistor output optocoupler manufactured by Vishay Semiconductor Opto Division. It features an NPN phototransistor with a base connection, housed in a compact 6-SMD surface-mount package. The device provides electrical isolation with a rated insulation voltage of 5000 Vrms. Key electrical parameters include a maximum collector-emitter voltage of 100 V and a maximum collector current of 50 mA. The forward voltage is typically 1.25 V, with a maximum DC forward current of 60 mA. Power dissipation is limited to 150 mW, and the unit operates within a temperature range of -55°C to +100°C.

Feature Summary

• Integrates an NPN phototransistor with an accessible base terminal for enhanced circuit control flexibility.

Applications

• Industrial signal isolation circuits
• Consumer electronics interface protection
• General-purpose digital signal transmission

Procurement Notes

Verify the specific suffix X002 confirms the 6-SMD tape and reel packaging configuration distinct from through-hole variants. Ensure component authenticity through authorized distribution channels. Confirm RoHS compliance status via official documentation prior to integration into regulated assemblies.

Selection Notes

Select this component when surface-mount space constraints require a compact isolation solution. The integrated base connection offers design advantages for high-speed or linear applications compared to standard configurations. Validate thermal management requirements against the 150 mW power dissipation limit during operation.

Part Context

This model belongs to the SFH601 series of phototransistor output optocouplers. The series provides reliable galvanic isolation between input and output circuits. The X002 designation specifically identifies the surface-mount variant, differing from DIP packages found in other series members.

Replacement Considerations

Cross-reference with SFH601-3 for equivalent through-hole functionality if board layout permits. Verify pinout compatibility and electrical parameter alignment before substituting with generic alternatives.