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The SFH609-2XSM is a single-channel phototransistor output optocoupler manufactured by Isocom Components. It features a DIP-6 package and operates with a DC input current type. The device provides an isolation voltage of 5300 Vrms and supports a maximum forward current of 60 mA. Key electrical parameters include a typical rise time of 2 µs, a typical fall time of 11 µs, and a minimum current transfer ratio of 40% with a maximum of 80%. It functions within a temperature range of -55°C to 100°C.
Verify the specific suffix 'XSM' against official manufacturer documentation to confirm lead frame configuration and tape-and-reel packaging specifications. Ensure the component meets required safety certifications such as UL or VDE for the intended application environment. Cross-reference datasheet parameters like CTR and isolation voltage with system design requirements before finalizing procurement.
Select this component when a standard phototransistor output optocoupler with DIP-6 packaging is required. Consider the 5300 Vrms isolation rating for applications demanding high dielectric strength. Evaluate the 40-80% current transfer ratio range to ensure adequate noise margin in the target circuit design compared to alternative series options.
This part belongs to the SFH609 series of optocouplers from Isocom Components. The series typically includes variants with different lead forms and output characteristics, such as the SFH609-1 through SFH609-5. These components are generally recognized for their reliability in general-purpose isolation applications within the broader family of infrared optoelectronic devices.
Direct substitutes may include other SFH609 series variants (e.g., SFH609-1, SFH609-3) depending on specific lead form and CTR requirements. Generic equivalents should be verified for pinout compatibility and electrical parameter alignment.