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The SI2439-A-GMR is an ISOModem network controller and processor IC manufactured by Skyworks Solutions Inc. Designed for system-side applications, it supports V.34 data transmission standards with a maximum data rate of 33.6 kb/s. The device operates on a single 3.3 V power supply, drawing 17 mA during operation, within a voltage range of 3 V to 3.6 V. It features SPI and UART interface types and functions at a frequency of 4.92 MHz. The component is housed in a 38-QFN package (5x7 mm) suitable for surface mount installation. It operates reliably within a temperature range of 0°C to +70°C and carries Moisture Sensitivity Level 3.
Verify the specific suffix against official Skyworks documentation to confirm package type and tape-and-reel configuration. Ensure compatibility with existing PCB footprints for the 38-QFN form factor. Check moisture sensitivity handling requirements prior to assembly. Confirm RoHS compliance status through current manufacturer declarations. Validate operating temperature ranges against final application environmental conditions.
Select this component when V.34 protocol support and electrical isolation are required in a compact surface-mount package. Compare pinout compatibility with legacy designs if replacing older modem controllers. Evaluate power consumption constraints against the 17 mA operational current draw. Consider the 3.3 V logic level compatibility with host microcontrollers or processors.
The SI2439 belongs to the Skyworks ISOmodem family, which specializes in integrated modem solutions for industrial and commercial applications. This series combines modem functionality with isolation capabilities to protect sensitive system components from line-side disturbances. The A-GMR variant specifically denotes the tape-and-reel packaging option for automated assembly processes.
Consult Skyworks official documentation for direct cross-reference part numbers. Verify functional equivalence regarding V.34/V.92 support and isolation ratings before substitution. Check for any pinout differences that may require PCB redesign.