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SI8641BD-AS2 is listed in the Digital Isolators range at ChipApex. The manufacturer field lists Skyworks Solutions Inc.. Its product description is DGTL ISOLTR 5KV 4CH GP 16-SOIC. Review the specifications below when checking this part for your BOM.
The SI8641BD-AS2 is a low-power, quad-channel digital isolator from Skyworks Solutions. It features four unidirectional channels with three forward and one reverse configuration. The device utilizes capacitive coupling technology to provide electrical isolation with an insulation voltage of 5000 Vrms. It supports data rates up to 150 Mb/s and operates within a supply voltage range of 2.375 V to 5.5 V. Key timing parameters include a propagation delay of 8 ns, rise/fall times of 4 ns, and a pulse width of 5 ns. The component is housed in a SOIC-Wide-16 package and is qualified under AEC-Q100 standards for automotive applications.
Verify the specific suffix AS2 against official Skyworks documentation to confirm package type and tape/reel specifications. Ensure compatibility with AEC-Q100 requirements if used in automotive designs. Cross-reference the SOIC-Wide-16 footprint with PCB layout guidelines. Confirm that the 5 kVrms insulation rating meets system safety standards. Validate input/output voltage thresholds against the target logic family before integration.
Select this component when high-speed isolation is required alongside automotive reliability standards. The mixed channel configuration suits interfaces needing both upstream and downstream data transfer. Consider the 8 ns propagation delay for timing-critical applications. The wide supply voltage range offers flexibility in power domain translation. Evaluate thermal performance given the 275 mW power dissipation in the SOIC-Wide-16 package.
The SI8641BD-AS2 belongs to the Si864x series of digital isolators. This family emphasizes low power consumption and high-speed operation without requiring start-up initialization. The device represents a solution for replacing traditional optocouplers in modern electronic designs. It integrates capacitive isolation barriers on a single silicon die. The series supports various packaging options to accommodate different board space constraints.
Public confirmed substitute part numbers are not available in the provided source material.
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