SIGC07T60NCX7SA1

SIGC07T60NCX7SA1

  • Description:IGBT NPT 600V 6A DIE
  • Series:-

SKU:4d7872dbe982 Category: Brand:

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Product Detailed Parameters

  • Description:IGBT NPT 600V 6A DIE
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Bulk
  • IGBT Type:NPT
  • Voltage - Collector Emitter Breakdown (Max):600 V
  • Current - Collector (Ic) (Max):6:00 AM
  • Current - Collector Pulsed (Icm):18 A
  • Vce(on) (Max) @ Vge, Ic:2.5V @ 15V, 6A
  • Power - Max:-
  • Switching Energy:-
  • Input Type:Standard
  • Gate Charge:-
  • Td (on/off) @ 25°C:21ns/110ns
  • Test Condition:300V, 6A, 54Ohm, 15V
  • Reverse Recovery Time (trr):-
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:Die
  • Supplier Device Package:Die
  • Grade:-
  • Qualification:-

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SIGC07T60NCX7SA1

Overview

The SIGC07T60NCX7SA1 is a silicon Insulated Gate Bipolar Transistor (IGBT) manufactured by Infineon Technologies. It features a collector-emitter voltage rating of 600 V and utilizes a die package configuration. The component is designed for high-power applications, operating within a temperature range that supports robust industrial performance. As a single-channel device, it integrates three chips on a wafer substrate to optimize power density and thermal management capabilities.

Feature Summary

  • High-voltage capability with a 600 V collector-emitter rating
  • Multi-chip integration on a single wafer substrate
  • Silicon-based construction for reliable switching performance

Applications

  • Industrial motor drives
  • Power supply units
  • Inverter systems

Procurement Notes

Verify the specific datasheet version and technical parameters directly from Infineon Technologies official documentation before procurement. Confirm that the die package format aligns with your assembly requirements. Ensure compliance with relevant environmental standards such as RoHS and REACH regulations applicable to your region. Cross-reference the manufacturer part number to avoid counterfeit components.

Selection Notes

Select this component when a 600 V IGBT with integrated multi-chip architecture is required. Consider the die package constraints for your PCB or module design. Evaluate thermal management solutions suitable for wafer-level integration. Compare electrical characteristics against system voltage and current demands to ensure adequate safety margins.

Part Context

This IGBT belongs to Infineon's high-power semiconductor portfolio, focusing on efficient energy conversion. It complements other discrete and module solutions in industrial automation. The technology supports compact designs by consolidating multiple chip functions into a single die structure, enhancing reliability compared to discrete alternatives.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Consult Infineon Technologies official resources for potential cross-references or newer generation replacements that meet identical electrical specifications.

SIGC07T60NCX7SA1SIGC07T60NCX7SA1

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