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SKY66112-11 is listed in the RF Front End (LNA + PA) range at ChipApex. The manufacturer field lists Skyworks Solutions Inc.. Its product description is CONNECTED HOME/WEARABLEBLE+ZIGBE. Review the specifications below when checking this part for your BOM.
The SKY66112-11 is a fully integrated RF front-end module designed for ZigBee, Thread, and Bluetooth Smart applications. It operates within the 2.4 GHz to 2.483 GHz frequency range. The device features a noise figure of 2 dB and provides gain options of 11 dB or 22 dB. It functions with a supply voltage between 1.7 V and 3.3 V. Current consumption varies by mode: 5 uA in standby, 3.5 mA in receive, and 115 mA in transmit. The third-order intercept point (OIP3) is 0 dBm, and the P1dB compression point is -8 dBm. It utilizes a 22-MCM package measuring 3.5x3 mm.
Verify component authenticity through authorized Skyworks distributors. Confirm RoHS compliance status and moisture sensitivity level (MSL 3) handling requirements during storage and assembly. Ensure packaging type matches production needs, as options include cut tape, reel, and Digi-Reel formats. Cross-reference datasheet revisions to confirm parameter consistency before finalizing procurement orders.
Select this module for compact designs requiring high integration in the 2.4 GHz ISM band. Evaluate gain settings against link budget requirements, noting available 11 dB and 22 dB options. Consider the 22-MCM footprint for space-constrained PCB layouts. Verify supply voltage compatibility with target battery systems, as the device supports 1.7 V to 3.3 V operation.
Part of the SKY66112 family targeting wireless connectivity solutions. Manufactured using silicon technology by Skyworks Solutions Inc. Designed for mass production in consumer electronics and industrial IoT sectors. Supports standard surface-mount assembly processes compatible with automated pick-and-place equipment.
No public confirmed substitute part numbers are documented. Direct replacement requires verification of pinout compatibility, gain specifications, and package dimensions against the original design requirements.
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