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SM9235-BCE-S-300-000 is listed in the Pressure Sensors Transducers range at ChipApex. The manufacturer field lists TE Connectivity Measurement Specialties. Its product description is SENS 0.04PSIG 0.12" 16BIT 16SOIC. Review the specifications below when checking this part for your BOM.
The SM9235-BCE-S-300-000 is a board-mount digital pressure sensor from the TE Connectivity SMI SM923X series. It features a gauge pressure range of 0 Pa to 300 Pa with a maximum pressure rating of 1.02 PSI (7 kPa). The device offers 16-bit resolution and ±2.5% accuracy, utilizing an I2C interface for data transmission. Operating on a supply voltage between 3 V and 5.5 V, it consumes 3.3 mA current. Housed in a 16-pin SOIC package with dual radial barbed ports (3 mm), it functions within a temperature range of -20°C to +85°C.
Verify component authenticity through authorized TE Connectivity distributors or certified partners. Confirm RoHS compliance status and humidity sensitivity handling requirements prior to assembly. Ensure storage conditions meet moisture protection standards to maintain sensor integrity during manufacturing processes.
Select this model when precise low-pressure measurement is required in space-constrained designs. The I2C interface simplifies integration with standard digital controllers. Consider the 16-bit resolution for applications demanding high signal fidelity. Validate that the 300 Pa gauge range aligns with specific system pressure requirements before implementation.
This component belongs to the SM923X family of board-mount pressure sensors designed for digital applications. It represents a specialized solution within TE Connectivity's measurement portfolio, focusing on compact form factors suitable for surface mount technology. The series emphasizes reliability and ease of integration for modern electronic systems requiring accurate environmental monitoring.
Consult official TE Connectivity documentation for verified substitute part numbers. Cross-reference specifications carefully to ensure compatibility with existing circuit designs and mechanical constraints.
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