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SMA32-1 is listed in the RF Amplifiers range at ChipApex. The manufacturer field lists MACOM Technology Solutions. Its product description is IC RF AMP GPS 100MHZ-2GHZ SMD. Review the specifications below when checking this part for your BOM.
The SMA32-1 is a discrete hybrid RF amplifier from MACOM Technology Solutions, designed for the 100 MHz to 2 GHz frequency range. It utilizes thin film manufacturing processes to ensure accurate performance and high reliability. The device operates on a single 15 V supply with a current consumption of 94 mA. Key electrical specifications include a typical gain of 11.5 dB and a noise figure of 2.5 dB. It features a P1dB compression point of 21 dBm and an OIP3 of 32 dBm. The component is suitable for surface mount installation.
Verify the specific ordering suffix against the official MACOM datasheet to confirm pinout compatibility and functional parameters. Ensure that any variant suffixes do not alter the critical electrical characteristics required for your design. Confirm the package type matches your PCB footprint requirements before finalizing the procurement order.
Select the SMA32-1 when broadband amplification between 100 MHz and 2 GHz is required with low noise performance. The 2.5 dB noise figure makes it suitable for sensitive receiver front-ends. Consider its 15 V bias requirement and 94 mA current draw during power budgeting. The hybrid construction offers robustness compared to monolithic alternatives in harsh environments.
This component belongs to MACOM's portfolio of ultra-small broadband general-purpose amplifiers. These devices are engineered for telecommunications, industrial, defense, and data center industries. The SMA32-1 represents a solution combining precise thin-film technology with broad operational bandwidth for critical signal processing tasks.
Consult the official MACOM documentation for confirmed substitute part numbers. Cross-reference electrical parameters such as gain, noise figure, and linearity to ensure functional equivalence. Verify that any alternative component meets the same thermal and mechanical constraints.
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