SMBT3906SE6327HTSA1

Overview

The Infineon SMBT3906SE6327HTSA1 is a PNP silicon switching transistor housed in an SC74 (SOT363) package. It features a collector-emitter voltage of 40 V and a maximum collector current of 200 mA. The device provides a DC current gain ranging from 30 to 300 depending on the operating point, with a transition frequency of 250 MHz. It operates within a junction temperature range of -65 °C to 150 °C and complies with AEC-Q101 automotive qualification standards.

Feature Summary

• High DC current gain across a wide collector current range
• Low collector-emitter saturation voltage for efficient switching
• Automotive qualified according to AEC-Q101 standards

Applications

• General-purpose switching applications
• Driver circuits for loads such as relays or lamps
• Complementary pairing with NPN transistors in amplifier stages

Procurement Notes

Verify the specific ordering suffix against official Infineon documentation to confirm the exact package variant and tape-and-reel specifications. Ensure that the component meets the required environmental and automotive qualification standards for the intended deployment environment before finalizing procurement.

Selection Notes

Select this component when a compact PNP switching solution with automotive reliability is required. Consider the thermal resistance characteristics of the SC74 package for power dissipation calculations. Verify compatibility with complementary NPN types like the SMBT3904 if push-pull configurations are needed.

Part Context

This part belongs to the SMBT3906 series of PNP silicon switching transistors manufactured by Infineon Technologies. The series includes variants in SOT23 and SOT363 packages, offering high current gain and low saturation voltages suitable for general-purpose switching tasks in consumer and automotive electronics.

Replacement Considerations

Direct substitutes include other automotive-qualified PNP transistors in the SOT363 package with matching 40V VCEO and 200mA IC ratings. Verify pinout compatibility and thermal performance parameters before substitution.