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SN74LV174APWR is listed in the Flip Flops range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC FF D-TYPE SNGL 6BIT 16TSSOP. Review the specifications below when checking this part for your BOM.
The SN74LV174APWR is a hex D-type flip-flop manufactured by Texas Instruments, featuring positive-edge triggering and an asynchronous clear function. It operates within a supply voltage range of 2 V to 5.5 V, supporting high-speed digital logic applications with a maximum propagation delay of 7.5 ns at 5 V. The device utilizes a 16-pin TSSOP surface-mount package and includes typical output ground bounce performance below 0.8 V at 3.3 V. Designed for industrial temperature ranges from -40°C to 125°C, it ensures reliable data storage in bus interface systems.
Verify the specific ordering suffix matches the required packaging format, as standard variants may differ in reel specifications. Confirm that the component meets RoHS3 compliance requirements for your assembly process. Ensure the selected part number corresponds to the correct pinout and thermal characteristics for your PCB layout. Cross-reference the manufacturer's latest datasheet revision to confirm any updates to electrical parameters or mechanical dimensions before finalizing procurement.
Select this component when a hex D-type flip-flop with asynchronous clear functionality is required for high-speed digital applications. Consider the 2 V to 5.5 V operating range to ensure compatibility with your system's power supply rails. Evaluate the 16-pin TSSOP package constraints against your available board space and routing density. Verify that the maximum propagation delay of 7.5 ns meets your timing requirements for the intended clock frequencies.
This device belongs to the SN74LV family of low-voltage CMOS logic ICs, designed for operation in systems ranging from 2 V to 5.5 V. The LV series offers improved performance over standard TTL while maintaining compatibility with various logic families. As a hex flip-flop, it provides multiple storage elements in a single package, reducing component count compared to individual D-type units. The TSSOP package facilitates automated surface-mount assembly processes.
SN74LV174ADWR
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