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SN74LV374ATNS is listed in the Flip Flops range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC FF D-TYPE SNGL 8BIT 20SO. Review the specifications below when checking this part for your BOM.
The SN74LV374ATNS is an octal edge-triggered D-type flip-flop with three-state outputs manufactured by Texas Instruments. It operates within a supply voltage range of 2V to 5.5V and features low static current consumption of 20µA. The device utilizes a 20-pin SSOP package and supports a maximum propagation delay of 19.3ns at 5V with 50pF load. It provides 16mA output drive capability for both high and low states, ensuring robust signal integrity across industrial temperature ranges from -40°C to 125°C.
Verify the specific suffix 'TNS' indicates the SSOP-20 package variant when sourcing. Confirm RoHS compliance status and lead times directly with authorized distributors or Texas Instruments. Ensure environmental specifications match application requirements, particularly regarding the extended temperature range up to 125°C. Cross-reference ordering information with official datasheets to avoid packaging discrepancies.
Select this component for applications requiring wide voltage operation and low power consumption. The SSOP package suits space-constrained surface-mount designs. Compare propagation delays against system timing requirements at the target supply voltage. Consider the 16mA drive strength for driving moderate capacitive loads on shared buses without additional buffering stages.
This part belongs to the SN74LV374A series of octal edge-triggered flip-flops. It shares functional similarities with other LV logic family members but differs in package type and specific electrical characteristics. The SN74LV374ATNS specifically denotes the SSOP-20 housing variant, distinguishing it from TSSOP or SOIC alternatives within the same logical family.
SN74LV374ADBR (SSOP-20) offers identical functionality with potentially different thermal or mechanical tolerances. SN74LV374APWR serves as a pin-compatible alternative using the TSSOP-20 package. Verify package dimensions and thermal performance before substituting to ensure board layout compatibility.
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