SPIDERSOM L

Microcontrollers, Microprocessor, FPGA Modules Overview

The SPIDERSOM L is a System-on-Module based on the Intel PSG MAX10 FPGA. It measures 70.00mm x 35.00mm and operates within a temperature range of 0°C to 70°C. The module features a core processor speed of 25MHz. It is packaged in a box format with pin connectors for integration into embedded designs.

Microcontrollers, Microprocessor, FPGA Modules Feature Summary

• Programmable non-volatile solution utilizing Intel MAX10 FPGA technology
• Delivers full-featured FPGA capabilities for embedded applications

Microcontrollers, Microprocessor, FPGA Modules Applications

• Embedded industrial control systems
• IoT device prototyping
• Custom hardware acceleration modules

Microcontrollers, Microprocessor, FPGA Modules Procurement Notes

Verify the specific datasheet version and electrical characteristics directly from ARIES Embedded or authorized distributors before finalizing design integration. Confirm that the operating temperature range and physical dimensions meet your enclosure requirements. Ensure compatibility with your baseboard connector specifications.

Microcontrollers, Microprocessor, FPGA Modules Selection Notes

Select this module when a compact, low-power FPGA solution is required for programmable logic tasks. The MAX10 architecture supports both analog and digital processing. Consider the 25MHz clock speed and thermal limits for performance planning against alternative high-speed FPGA options.

Microcontrollers, Microprocessor, FPGA Modules Part Context

This component belongs to the SpiderSoM family produced by ARIES Embedded. These modules are designed to simplify the integration of Intel PSG MAX10 FPGAs into custom carrier boards. The product line focuses on providing standardized form factors for rapid development cycles.

Microcontrollers, Microprocessor, FPGA Modules Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Designers should consult ARIES Embedded for direct equivalents or next-generation module upgrades.