ST33KTPM2I3WBZA9

Overview

The ST33KTPM2I3WBZA9 is a flash memory-based Trusted Platform Module (TPM) compliant with TCG TPM Library Specification 2.0, revision 1.59 errata version 1.4, and TCG PC Client TPM Profile (PTP) version 1.06. It operates within an extended temperature range of −40 °C to 105 °C and supports supply voltages of 1.8 V or 3.3 V. The device provides SPI communication at up to 48 MHz and I²C support at up to 1 MHz. It targets Common Criteria EAL4+ and FIPS 140-3 certifications.

Feature Summary

• Compliant with TCG TPM 2.0 specifications and PTP 1.06.
• Supports SPI (up to 48 MHz) and I²C (up to 1 MHz) interfaces.
• Extended operating temperature range from −40 °C to 105 °C.
• Includes fault-tolerant firmware loader and SP800-193 compliance.

Applications

• Embedded computing applications
• Industrial devices
• Consumer electronics

Procurement Notes

Verify the factory firmware version associated with the specific ordering code before integration. Confirm that the UFQFPN32 wettable flank package dimensions align with the PCB footprint design. Ensure power supply filtering meets the recommended 100 nF and 1 µF capacitor requirements for stable operation.

Selection Notes

Select this component when industrial-grade temperature resilience and TCG certification are required. The UFQFPN32 package offers wettable flanks for enhanced inspection reliability. Verify interface compatibility, as the device supports both SPI and I²C configurations depending on hardware setup.

Part Context

This part belongs to the STSAFE-TPM family, which provides standardized security solutions for embedded and computing applications. The ST33KTPM2I series is designed to protect information confidentiality, integrity, and authenticity through certified cryptographic services and secure key storage.

Replacement Considerations

ST33KTPM2I3WBZB1: Same UFQFPN32 package but ships with factory firmware version 10.512 instead of 10.257.